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latb t66b hyper multi topled ? enhanced optical power led (hop2000 / aton ? ) vorl ? ufige daten / preliminary data 2002-05-24 1 besondere merkmale ? geh ? usetyp: wei ? es p-lcc-4 geh ? use; kontrasterh ? hung durch schwarze oberfl ? che (rgb-displays) und diffuses harz besonderheit des bauteils: additive farbmischung durch unabh ? ngige ansteuerung aller chips wellenl ? nge: 617 nm (amber), 528 nm (true green), 470 nm (blau) abstrahlwinkel: lambertscher strahler (120 ) technologie: ingaalp (amber), ingan (true green, blau) optischer wirkungsgrad: 24 lm/w (amber), 13 lm/w (true green), 3 lm/w (blau) gruppierungsparameter: lichtst ? rke verarbeitungsmethode: f r alle smt-best cktechniken geeignet l ? tmethode: ir reflow l ? ten und wellenl ? ten (ttw) vorbehandlung: nach jedec level 2 gurtung: 8 mm gurt mit 2000/rolle, ? 180 mm oder 8000/rolle, ? 330 mm esd-festigkeit: esd-sicher bis 2 kv nach eos/esd-5.1-1993 anwendungen anzeigen im innen- und au ? enbereich (z.b. im verkehrsbereich; laufschriftanzeigen) leuchtdiodenchips getrennt ansteuerbar vollfarbdisplays bzw. rgb-displays hinterleuchtung (lcd, schalter, tasten, displays, werbebeleuchtung, allgemeinbeleuchtung) einkopplung in lichtleiter features package: white p-lcc-4 package; higher contrast by a black surface (rgb-displays) and diffused resin feature of the device: additive mixture of color stimuli by independent driving of each chip wavelength: 617 nm (amber), 528 nm (true green), 470 nm (blue) viewing angle: lambertian emitter (120 ) technology: ingaalp (amber), ingan (true green, blue) optical efficiency: 24 lm/w (amber), 13 lm/w (true green), 3 lm/w (blue) grouping parameter: luminous intensity assembly methods: suitable for all smt assembly methods soldering methods: ir reflow soldering and ttw soldering preconditioning: acc. to jedec level 2 taping: 8 mm tape with 2000/reel, ? 180 mm or 8000/reel, ? 330 mm esd-withstand voltage: up to 2 kv acc. to eos/esd-5.1-1993 applications indoor and outdoor displays (e.g. displays for traffic; light writing displays) led chips can be controlled separately full color displays, rgb-displays backlighting (lcd, switches, keys, displays, illuminated advertising, general lighting) coupling into light guides
2002-05-24 2 latb t66b anm.: -78 gesamter farbbereich, lieferung in einzelgruppen (siehe seite 5 ) die standardlieferform von serientypen beinhaltet eine familiengruppe. einzelne gruppen sind nicht erh?ltlich. in einer verpackungseinheit / gurt ist immer nur eine gruppe pro farbe enthalten. dimmverh?ltnis im gleichstrom-betrieb max. 5:1 fr amber note: -78 total color tolerance range, delivery in single groups (please see page 5 ) the standard shipping format for serial types includes a family group. individual groups are not available. no packing unit / tape ever contains more than one luminous intensity group per color. dimming range for direct current mode max. 5:1 for amber typ type emissions- farbe color of emission farbe der lichtaustritts- fl ? che color of the light emitting area lichtst ? rke luminous intensity i f = 20 ma i v (mcd) amber true green blue latb t66b amber true green blue colorless diffused and black painted package surface 180 ... 450 180 ... 450 45 ... 112 bestell - information ordering information typ type bestellnummer ordering code latb t66b-st-1+st-78+pq-1 latb t66b-st-1+st-7+pq-1 latb t66b-st-1+st-8+pq-1 q65110-a0152 q65110-a0181 q65110-a0182
latb t66b 2002-05-24 3 grenzwerte maximum ratings bezeichnung parameter symbol symbol werte values einheit unit la lt lb betriebstemperatur operating temperature range t op ? 40 ? + 100 c lagertemperatur storage temperature range t stg ? 40 ? + 100 c sperrschichttemperatur junction temperature t j + 125 + 125 + 110 c durchlassstrom forward current i f 70 30 30 ma sto ? strom surge current t p = 10 s, d = 0.005 i fm 0.10 0.25 0.20 a sperrspannung reverse voltage v r 555v leistungsaufnahme power consumption p tot 180 140 140 mw w ? rmewiderstand thermal resistance sperrschicht/umgebung 1 chip on junction/ambient 3 chips on sperrschicht/l ? tpad 1 chip on junction/solder point 3 chips on montage auf pc-board fr 4 (padgr ?? e 16 mm 2 ) mounted on pc board fr 4 (pad size 16 mm 2 ) r th ja r th ja r th js r th js 480 770 260 420 530 820 310 470 530 820 310 470 k/w k/w k/w k/w
2002-05-24 4 latb t66b kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol werte values einheit unit la lt lb wellenl ? nge des emittierten lichtes (typ.) wavelength at peak emission i f = 20 ma peak 628 523 465 nm dominantwellenl ? nge 1) (typ.) dominant wavelength i f = 20 ma dom 617 ? 2 / +7 528 ?9 470 ?6 nm spektrale bandbreite bei 50 % i rel max (typ.) spectral bandwidth at 50 % i rel max i f = 20 ma ? 16 33 25 nm abstrahlwinkel bei 50 % i v (vollwinkel) (typ.) viewing angle at 50 % i v 2 ? 120 120 120 grad deg. durchlassspannung 2) (min.) forward voltage (typ.) i f = 20 ma (max.) v f v f v f 2.0 2.4 3.5 4.3 3.8 4.3 v v v sperrstrom (typ.) reverse current (max.) v r = 5 v i r i r 0.01 10 0.01 10 0.01 10 a a temperaturkoeffizient von peak (typ.) temperature coefficient of peak i f =20 ma; ? 10 c t 100 c tc peak 0.13 0.04 0.05 nm/k temperaturkoeffizient von dom (typ.) temperature coefficient of dom i f = 20 ma; ? 10 c t 100 c tc dom 0.06 0.03 0.04 nm/k temperaturkoeffizient von v f (typ.) temperature coefficient of v f i f = 20 ma; ? 10 c t 100 c tc v ? 1.8 ? 3.6 ? 3.1 mv/k optischer wirkungsgrad (typ.) optical efficiency i f = 20 ma opt 24 13 3 lm/w 1) wellenl ? ngen werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 1 nm ermittelt. wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm. 2) spannungswerte werden mit einer stromeinpr ? gedauer von 1 ms und einer genauigkeit von ?,1 v ermittelt. voltages are tested at a current pulse duration of 1 ms and a tolerance of ?.1 v.
latb t66b 2002-05-24 5 helligkeitswerte werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 11 % ermittelt. luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of 11 %. 1) wellenl ? ngengruppen / wavelength groups gruppe group true green einheit unit min. max. 7 519 528 nm 8 528 537 nm lichtgruppe luminous intensity group lichtst ? rke luminous intensity i v (mcd) lichtstrom luminous flux v (mlm) lichtst ? rke luminous intensity i v (mcd) lichtstrom luminous flux v (mlm) lichtst ? rke luminous intensity i v (mcd) lichtstrom luminous flux v (mlm) amber true green blue s+s+p s+s+q s+t+p s+t+q t+s+p t+s+q t+t+p t+t+q 180 ... 280 180 ... 280 180 ... 280 180 ... 280 280 ... 450 280 ... 450 280 ... 450 280 ... 450 680 (typ.) 680 (typ.) 680 (typ.) 680 (typ.) 1075 (typ.) 1075 (typ.) 1075 (typ.) 1075 (typ.) 180 ... 280 180 ... 280 280 ... 450 280 ... 450 180 ... 280 180 ... 280 280 ... 450 280 ... 450 680 (typ.) 680 (typ.) 1075 (typ.) 1075 (typ.) 680 (typ.) 680 (typ.) 1075 (typ.) 1075 (typ.) 45 ... 71 71 ... 112 45 ... 71 71 ... 112 45 ... 71 71 ... 112 45 ... 71 71 ... 112 95 (typ.) 270 (typ.) 95 (typ.) 270 (typ.) 95 (typ.) 270 (typ.) 95 (typ.) 270 (typ.) gruppenbezeichnung auf etikett group name on label beispiel: t-1+s-7+p-1 example: t-1+s-7+p-1 lichtgruppe luminous intensity group (amber) wellenl ? nge (keine gruppierung) wavelength (no grouping) (amber) lichtgruppe luminous intensity group (true green) wellenl ? nge wavelength (true green) lichtgruppe luminous intensity group (blue) wellenl ? nge (keine gruppierung) wavelength (no grouping) (blue) t1s7p1
2002-05-24 6 latb t66b relative spektrale emission i rel = f ( ), t a = 25 c, i f = 20 ma relative spectral emission v( ) = spektrale augenempfindlichkeit standard eye response curve abstrahlcharakteristik i rel = f ( ? ) radiation characteristic 0 350 nm ohl01452 i 20 40 60 80 % 100 rel blue 400 450 500 550 600 650 700 true green v amber 0 0.2 0.4 1.0 0.8 0.6 ? 1.0 0.8 0.6 0.4 0? 10? 20? 40? 30? ohl01660 50? 60? 70? 80? 90? 100? 0? 20? 40? 60? 80? 100? 120?
latb t66b 2002-05-24 7 durchlassstrom i f = f ( v f ) forward current t a = 25 c durchlassstrom i f = f ( v f ) forward current t a = 25 c relative lichtst ? rke i v / i v(20 ma) = f ( i f ) relative luminous intensity t a = 25 c relative lichtst ? rke i v / i v(25 c) = f ( t a ) relative luminous intensity i f = 20 ma ohl00444 1.4 ma 10 1 10 5 -2 5 0 10 -1 5 10 v 10 2 f i f v 1.6 1.8 2.0 2.2 2.4 ohl01481 i f 3.5 23 2.5 5 v 4.5 4 v f 5 ma 10 2 10 -1 5 10 0 5 10 1 true green blue v v (20 ma) 10 -1 0 10 10 12 10 ma ohl01473 f i i i 55 true green blue 1 10 -2 -3 10 10 5 -1 0 5 10 5 10 amber v v (25 ? c) ohl01477 i i t a 0 020406080 100 ? c 0.4 0.8 1.2 0.2 0.6 amber true green blue
latb t66b 2002-05-24 8 maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current 1 chip on maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current 1 chip on maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current 3 chips on maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current 3 chips on true green ? c ohl01612 0 020 60 40 80 t blue ma i f amber 100 temp. ambient t a 10 20 30 40 50 60 70 80 true green ? c ohl01610 0 020 60 40 80 t blue ma i f amber 100 temp. solder point t s 10 20 30 40 50 60 70 80 true green ? c ohl01609 0 020 60 40 80 t blue ma i f amber 100 temp. ambient t a 10 20 30 40 50 60 70 80 true green ? c ohl01607 0 020 60 40 80 t blue ma i f amber 100 temp. solder point t s 10 20 30 40 50 60 70 80
latb t66b 2002-05-24 9 zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c amber (1 chip on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c amber (3 chips on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 85 c amber (1chip on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 85 c amber (3 chips on) ohl01505 f i 0 0.02 0.04 0.06 0.08 0.1 0.12 a p t -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 0.005 0.05 0.5 s ohl00193 f i 0 0.02 0.04 0.06 0.08 0.10 0.12 a p t -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 0.005 0.05 0.5 s ohl01604 f i 0 0.02 0.04 0.06 0.08 0.10 0.12 a p t -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 0.005 0.05 0.5 s ohl01606 f i 0 0.02 0.04 0.06 0.08 0.10 0.12 a p t -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 0.005 0.05 0.5 s
latb t66b 2002-05-24 10 zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c true green (1 chip on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c true green (3 chips on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 85 c true green (1 chip on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 85 c true green (3 chips on) ohl01400 0 f i 10 10 -5 -4 -3 10 10 -2 10 -1 10 0 s 10 1 10 2 p t 0.05 0.10 0.15 0.20 0.25 0.30 0.05 0.5 0.2 0.1 d 0.02 0.01 0.005 = a ohl01586 10 -5 f i t p t = d p t t p t f i 0.005 0.01 0.02 0.05 d = 10 -4 10 -3 10 -2 10 -1 10 0 10 1 0 a 2 10 s 0.5 0.05 0.10 0.15 0.20 0.30 0.2 0.1 0.25 ohl01584 10 -5 f i t p t = d p t t p t f i 0.005 0.01 0.02 0.05 d = 10 -4 10 -3 10 -2 10 -1 10 0 10 1 0 a 2 10 s 0.5 0.05 0.10 0.15 0.20 0.30 0.2 0.1 0.25 ohl01575 10 -5 f i t p t = d p t t p t f i 0.005 0.01 0.02 0.05 d = 10 -4 10 -3 10 -2 10 -1 10 0 10 1 0 0.05 0.10 a 2 10 s 0.5 0.2 0.1
latb t66b 2002-05-24 11 zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c blue (1 chip on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c blue (3 chips on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 85 c blue (1 chip on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 85 c blue (3 chips on) ohl01405 0 f i 10 10 -5 -4 -3 10 10 -2 10 -1 10 0 s 10 1 10 2 p t 0.05 0.10 0.15 0.20 0.25 0.30 0.05 0.5 0.2 0.1 d 0.02 0.01 0.005 = a d t t = p t t p i f ohl01576 10 -5 f i t p t = d p t t p t f i 0.005 0.01 0.02 0.05 d = 10 -4 10 -3 10 -2 10 -1 10 0 10 1 0 a 2 10 s 0.5 0.2 0.05 0.10 0.15 0.20 0.30 0.1 0.25 ohl01579 10 -5 f i t p t = d p t t p t f i 0.005 0.01 0.02 0.05 0.1 d = 10 -4 10 -3 10 -2 10 -1 10 0 10 1 0 a 2 10 s 0.5 0.05 0.10 0.15 0.20 0.30 0.2 0.25 ohl01577 10 -5 f i t p t = d p t t p t f i 0.005 0.01 0.02 0.05 0.1 d = 10 -4 10 -3 10 -2 10 -1 10 0 10 1 0 0.05 0.10 a 2 10 s 0.5 0.2
2002-05-24 12 latb t66b die farbkoordinaten des mischlichtes k ? nnen innerhalb des mit a) gekennzeichneten bereichs des farbdreiecks erwartet werden.der unbuntpunkt (x = 0,33, y = 0,33) ist mit + gekennzeichnet. the color coordinates of the mixed light can be expected within the area of the color triangle marked a). the achromatic point (x = 0.33, y = 0.33) is marked + . oha02290 + 520 530 540 550 560 570 580 590 600 610 620 630 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 a)
latb t66b 2002-05-24 13 ma ? zeichnung package outlines ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). gewicht / approx. weight: 34 mg 14 23 package marking gply6900 2.6 (0.102) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 0.8 (0.031) 0.6 (0.024) 3.0 (0.118) 3.4 (0.134) (2.4 (0.094)) 3.3 (0.130) 3.7 (0.146) 0.5 (0.020) 1.1 (0.043) 0.1 (0.004) typ 4 ? 1 0.18 (0.007) 0.4 (0.016) 0.6 (0.024) 1.7 (0.067) 2.1 (0.083) 0.9 (0.035) 0.7 (0.028) 1 cathode amber (a) 2 anode a, t, b 3 cathode blue (b) 4 cathode true green (t)
2002-05-24 14 latb t66b l ? tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 ir-reflow l ? tprofil (nach ipc 9501) ir reflow soldering profile (acc. to ipc 9501) ohly0597 0 0 50 100 150 200 250 50 100 150 200 250 300 t t ? c s 240-245 ? c 10-40 s 183 ? c 120 to 180 s defined for preconditioning: up to 6 k/s ramp-down rate up to 6 k/s ramp-up rate up to 6 k/s defined for preconditioning: 2-3 k/s
latb t66b 2002-05-24 15 wellenl ? ten (ttw) (nach cecc 00802) ttw soldering (acc. to cecc 00802) ohly0598 0 0 50 100 150 200 250 50 100 150 200 250 300 t t c s 235 c 10 s c ... 260 1. welle 1. wave 2. welle 2. wave 5 k/s 2 k/s ca 200 k/s cc ... 130 100 2 k/s zwangsk ? hlung forced cooling normalkurve standard curve grenzkurven limit curves
2002-05-24 16 latb t66b empfohlenes l ? tpaddesign ir reflow l ? ten recommended solder pad ir reflow soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohlpy439 padgeometrie f ? r verbesserte w ? rmeableitung improved heat dissipation paddesign for l ? tstoplack solder resist 1.1 (0.043) 4.5 (0.177) 1.5 (0.059) 2.6 (0.102) 3.3 (0.130) 0.5 (0.020) 7.5 (0.295) 0.4 (0.016) cathode marking kathoden markierung / cu fl ? che / 12 mm per pad 2 cu-area _ < 3.3 (0.130)
latb t66b 2002-05-24 17 empfohlenes l ? tpaddesign wellenl ? ten (ttw) recommended solder pad ttw soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). gurtung / polarit ? t und lage verpackungseinheit 2000/rolle, 180 mm oder 8000/rolle, 330 mm method of taping / polarity and orientation packing unit 2000/reel, 180 mm or 8000/reel, 330 mm ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohay0583 6.1 (0.240) 2.8 (0.110) 2 (0.079) 3 (0.118) 6 (0.236) 3.5 (0.138) 1.5 (0.059) 2 (0.079) 3.5 (0.138) 1 (0.039) 8 (0.315) 2.8 (0.110) 0.5 (0.020) 7.5 (0.295) solder resist l ? tstoplack pcb-direction bewegungsrichtung der platine 2 (0.079) padgeometrie f ? r improved heat dissipation verbesserte w ? rmeableitung paddesign for 2 cu fl ? che / > 12 mm per pad cu-area ohay0095 4 (0.157) 2.9 (0.114) 1.5 (0.059) 4 (0.157) 3.6 (0.142) 3.5 (0.138) 2 (0.079) 1.75 (0.069) 8 (0.315) ca cc
2002-05-24 18 latb t66b published by osram opto semiconductors gmbh & co. ohg wernerwerkstrasse 2, d-93049 regensburg ? all rights reserved. attention please! the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserved. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. if printed or downloaded, please find the latest version in the internet. packing please use the recycling operators known to you. we can also help you get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components 1 may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 2 life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. revision history: 2002-05-24 previous version: 2001-11-30 page subjects (major changes since last revision) 1 esd-withstand voltage 2 ordering informaion 5 grouping information

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